Broadcom lowers power consumption latest AI networking chips, Sian3 and Sian2M, while delivering high-speed data transmission for AI data centers.. The announcement on Tuesday marks a significant advancement in low-power, high-bandwidth optical connectivity, addressing the growing demands of AI and machine learning (ML) computing clusters.
The Sian3 chip, built on 3-nanometer process technology, is an upgrade over last year’s Sian2, which utilized 5-nanometer process technology. Meanwhile, Sian2M is a specialized version of Sian2, optimized for lower power consumption in multi-mode fiber applications.
Enhanced Performance and Power Efficiency
Broadcom’s latest chips operate with pulse amplitude modulation (PAM-4) and a digital signal processor (DSP) in a physical layer (PHY) transceiver, ensuring seamless data transmission at speeds of 200 gigabits per second per lane.
“Broadcom’s Sian family of DSP PHYs is foundational to the low-power, high-bandwidth optical connectivity needed for AI/ML clusters,” said Vijay Janapaty, Vice President and General Manager of Broadcom’s Physical Layer Products Division.
He further emphasized that the 3nm Sian3 achieves over 20% power reduction for 1.6T optical modules, while Sian2M, with integrated VCSEL (vertical-cavity surface-emitting laser) drivers and 200G VCSELs, enhances cost and power efficiency for short-reach links.
Impact on AI and Stock Market Performance
Power efficiency remains a critical factor for companies scaling AI infrastructure, where optimizing computing clusters and data transmission is essential. Broadcom’s innovations ensure better scalability and energy efficiency in AI workloads.
In stock market trading on Tuesday, AVGO stock dipped 0.8% to 189.71. However, Broadcom ranks second among 39 stocks in IBD’s fabless semiconductor industry group, boasting a 95 out of 99 IBD Composite Rating. Additionally, AVGO stock remains a top performer on the IBD Tech Leaders list.
Availability and Future Outlook
Broadcom is offering early access samples of Sian3 and Sian2M to select customers. Mass production of Sian3 is expected to begin in the third quarter of this year, solidifying Broadcom’s leadership in AI networking solutions.
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